Low-pressure overmolding is a manufacturing process that utilizes low temperatures and pressures to mold components directly into a part. Due to its usage of reduced pressures, the process offers a wide range of advantages that can enhance the capabilities of the final product. While low-pressure overmolding can be applied to a variety of components, the process is especially beneficial for molding electronic components into products. To better understand the advantages of low-pressure overmolding electronics, continue reading.
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AVOID DAMAGE TO SENSITIVE COMPONENTS
Low-pressure overmolding is particularly well-suited for injection molding electronic items because the process applies less force when injecting its plastic material into the mold and is therefore significantly less likely to damage fragile components. By comparison, traditional overmolding can be problematic because it requires extreme temperatures and pressures that often endanger delicate equipment. For this reason, low-pressure overmolding can be particularly beneficial for safely encapsulating electronics into a molded part.
PROVIDE ENHANCED ENVIRONMENTAL PROTECTION
Low-pressure overmolding with RIM is also advantageous when encapsulating electronics because the process allows for any electronic item to be surrounded by a durable layer of polyurethane that protects the device without limiting its functionality. Due to this added layer of seamless protection, electronics can maintain their performance despite being exposed to chemicals, high temperatures, rain, wind, or other harsh environmental conditions.
IMPLEMENTING AND STRENGTHENING WIRELESS CAPABILITIES
Another benefit of low-pressure overmolding electronics is the process allows you to implement and even strengthen the wireless capabilities of a device into a molded part. When low-pressure overmolding an antenna or other electronic device into a part, the polyurethane shell that is created around the wireless device is less dense and restrictive than those created by higher pressure injection molding methods. As a result of this lower density, any radio signals from wireless components will be able to travel farther.
If you&#;re interested in implementing low-pressure overmolding to mold an electronic device into your part, Rimnetics can help. One of the most popular molding processes for carrying out low-pressure overmolding is reaction injection molding. Due to the low viscosity of the materials used in the process, high temperatures and pressures aren&#;t required to force the material into the mold. As such, it is an ideal option for low-pressure overmolding. To learn more about electronics injection molding, contact us today.
The Low-Pressure Molding Process (LPM) is an ideal overmolding electronics method for delicate, low-volume electronic equipment. The LPM process is similar to HPM but uses less pressure to inject molten plastic into a mold. Because the pressure is reduced, this method requires more time than HPM, but&#;compared to potting&#;it offers a variety of benefits to help improve the cost, quality and time involved in overmolding delicate electronics like PCBs, connectors, sensors and cable assemblies.
The High-Pressure Molding Process (HPM) is the manufacturing world&#;s answer to many production woes. Instead of pouring liquid resin, this overmolding method injects the resin at high pressure into a metal mold. The extreme pressure presses the resin more tightly against the mold walls to create greater detail or produce parts with complex geometry. High pressure also makes this process fast, resulting in less production time and resources, a high production rate and, ultimately, a less expensive product.
But, not all products can stand up to the force of high-pressure molding. PC board assemblies and other electrical parts are delicate and require a softer molding approach that can still outperform potting but doesn&#;t damage product components.
According to IPC Association Connecting Electronics Industries, the demand for printed circuit boards (PCB) and electronics manufacturing services has increased year-over-year by 39%. This surge is expected to continue. To keep up with demand, manufacturers must develop newer, leaner production processes that result in a faster turnaround time without adding to the cost of ownership or compromising quality.
Traditionally, manufacturers used potting to encapsulate and protect electrical components. This process involves pouring liquid resin over electrical components, boards or assemblies to insulate and protect the product against thermal shock, moisture, corrosive substances, etc.
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As opposed to the low-pressure molding process, the potting process involves many steps and requires a long curing period that increases the cycle time and can be conducive to shrinking, putting the electronic components at risk. Depending on the method used, potting materials and processes can also be quite expensive. For example, vacuum potting or using silicone rubber compounds.
The Benefits of Low-Pressure Molding Process for Electronics versus Potting
- Faster, Simpler Process/Reduced Development Cycle
LPM only involves three steps instead of seven or eight steps involved in traditional potting. The thermoplastic polyamide materials (also referred to as &#;hot melts&#;) are heated until they turn into liquid, are injected into a mold (which encapsulates the electronic part) and are left to cool and solidify. Unlike potting, LPM doesn&#;t require a curing process, which also substantially reduces the amount of time and risk involved in encapsulating an electronic part.
- Less Expensive
By using the simplified low-pressure molding process, manufacturers reduce the number of resources and manufacturing time involved in producing the product. This cuts down on the cost of labor and materials, and will ultimately lower the cost of ownership. Thanks to the lower injection pressure involved in LPM, mold sets can also be made using aluminum, which is an affordable material with excellent thermal conductivity.
3. Excellent Resistance and Protection
Despite a reduction in materials, time and cost, low pressure molding still provides delicate electrical parts with excellent protection and temperature or solvent resistance. Low pressure molding creates a watertight encapsulation and considerable room for customization, including the addition of logos and color coding.
4. Environmentally Responsible
The materials used for low pressure molding are non-toxic, non-hazardous and derived from natural ingredients. Additionally, the leftover materials are either biodegradable or can be recycled into new materials. The simplification of the production process also utilizes less energy than the traditional potting process.
Interested in learning more about overmolding electronics? Download our free guide.
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