What is a Low Pressure Molding System?
Low Pressure Molding System is a new way and technology to overmold electronics
faster,
safer and
greener! It is a reliable solution for overmolding PCB or circuitry. Its process takes just 15 to 60 seconds and the materials used are environment friendly. The Hot Melt Low Pressure Molding Machine parameters are easily set and operated. For these reasons, the Low Pressure Injection Molding System is increasingly being chosen as an alternative to encapsulation processes.
How Does Low Pressure Molding System Work ?
Low Pressure Molding Process System (LPM) involves loading unprotected PCBs and cable assemblies or other fragile
Process of Low Pressure Injection Molding System - only 3 Steps
Below is the sequence of images illustrating a typical 3-Step encapsulation using a low pressure molding process (LPM Process).
Step 1 : Insert
Insert the electronic parts into the cavity ( 5-10 seconds loading time).
Want more information on Low-Pressure Overmoulding Molding Techniques? Feel free to contact us.
Step 2 : Overmolding
Overmolding by LPM Low Pressure Molding Machine , cycle time about 15-60 seconds.
Step 3 : Take out
The overmolded part is easily cooled and taken out manually, and tested immediately after molding.
Low Pressure Injection Molding Process Video
Low Pressure Injection Molding System VS Potting and Sealing : What’s the Difference ?
The
Low Pressure Injection Molding (LPM)
Process is ideally suited to replace epoxy potting processes to save cycle time, labor cost, working space, and reduce material consumption with light weight and compact design, compared to the traditional potting process. We can compare LPM and Epoxy potting from the following:
● Environment Benefits
The materials of Low Pressure Molding (LPM) are natural adhesives, which are BPA-free, do not require UV curing ( which may cause skin cancer), and 100% recyclable, which also creates an efficient & comfortable working experience for the operators.
● Economy Benefits
Low Pressure Molding (LPM) process saves labor cost , space for storage , material consumption , and total cycle time is only less than 1/10 compare to Epoxy potting process.
● Performance Benefits
Low Pressure Molding System (LPM) with easier process to achieve waterproof, insulation, temperature resistance, flame retardant, vibration reduction ,and better bonding with various materials. which can support a compact lightweight product design with higher yield.
Low Pressure Overmolding Electronic Designs
When talking about Low Pressure Overmolding System, its waterproof molding solution is used widely for electronic parts design in various industries, such as medical care, smart city,
Low Pressure Molding Machines and Systems from KING’S
KING’S Solution has been dedicated to injection molding solutions for almost 4 decades.We have the experience of making thousands of sets of customized injection molding machines with tooling, automation, and auxiliary systems as complete turn-key solutions. Our Mission is to deliver “Green solution” as the “ Machine Soulmate” to our customers all over the world. Low pressure molding process is an innovative technology which is still developing in different applications, we believe our experience in engineering will support our customers to create the product in a faster, safer and greener way. For more information or to get started on your Low Pressure Molding Solution,
If you want to know more about our other products, please check the link below.
To keep updated about the latest news of KING’S Solution Machinery & Engineering, please follow us in our Social Media Channels :
Low Pressure Molding System is a new way and technology to overmold electronicsand! It is a reliable solution for overmolding PCB or circuitry. Its process takes just 15 to 60 seconds and the materials used are environment friendly. The Hot Melt Low Pressure Molding Machine parameters are easily set and operated. For these reasons, the Low Pressure Injection Molding System is increasingly being chosen as an alternative to encapsulation processes.Low Pressure Molding Process System (LPM) involves loading unprotected PCBs and cable assemblies or other fragile
electronic parts
into a precision mold , and then filling the cavity with appropriate low pressure molding materials , such as polyamide and polyolefin (hot-melt). The resin and material effectively cover the component in the desired shape, producing a sealed and protected product that can be immediately handled and tested.Below is the sequence of images illustrating a typical 3-Step encapsulation using a low pressure molding process (LPM Process).The(LPM)is ideally suited to replace epoxy potting processes to save cycle time, labor cost, working space, and reduce material consumption with light weight and compact design, compared to the traditional potting process. We can compare LPM and Epoxy potting from the following:The materials of Low Pressure Molding (LPM) are natural adhesives, which are BPA-free, do not require UV curing ( which may cause skin cancer), and 100% recyclable, which also creates an efficient & comfortable working experience for the operators.Low Pressure Molding (LPM) process saves labor cost , space for storage , material consumption , and total cycle time is only less than 1/10 compare to Epoxy potting process.Low Pressure Molding System (LPM) with easier process to achieve waterproof, insulation, temperature resistance, flame retardant, vibration reduction ,and better bonding with various materials. which can support a compact lightweight product design with higher yield.When talking about Low Pressure Overmolding System, its waterproof molding solution is used widely for electronic parts design in various industries, such as medical care, smart city,
automotive industry
, ex: electric vehicles, 5 G applications, etc. All these solutions are energy-saving and automated, for industry 4.0 lean production.has been dedicated to injection molding solutions for almost 4 decades.We have the experience of making thousands of sets of customized injection molding machines with tooling, automation, and auxiliary systems as complete turn-key solutions. Our Mission is to deliver “Green solution” as the “ Machine Soulmate” to our customers all over the world. Low pressure molding process is an innovative technology which is still developing in different applications, we believe our experience in engineering will support our customers to create the product in a faster, safer and greener way. For more information or to get started on your Low Pressure Molding Solution,
contact us
today.If you want to know more about our other products, please check the link below.
Low Pressure Injection Molding Turnkey Solution
To keep updated about the latest news of KING’S Solution Machinery & Engineering, please follow us in our Social Media Channels :
Low pressure molding, (or LPM) in particular, is as the name suggests, the use of lower pressure processes and techniques used where components may suffer from the normal pressure or extreme heat otherwise used in more industry standard pressure molding applications.
To reiterate, there are two main reasons an application may require the use of Low Pressure Molding.
Additional resources:What is the use of T section steel?
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Malleability
One major factor is the need for the applied thermoplastics to be more viscose. Viscosity allows the injected material to be applied to much small or complex spaces and cavities. To apply at low pressure often a manual gear pump process is used, this provides sufficient pressure to drive the viscose material between components.
This helps to prevent fragile components from becoming dislodged or broken and provides greater protection and stability to otherwise unprotected electronics.
The viscosity is measured in what is known as centipoise – a specific unit of measurement, and at around 410F (210C) this forms the consistency of ‘Pancake Syrup’ which is sufficient and safe for low pressure application.
Adhesiveness
Generally speaking, Polyamide materials are considered to be high-performance hot-melt. Polyamide has an adhesive quality that accompanies it and this is what helps to seal in components.
The Low Pressure Molding Application Process
If a PCB board or other circuitry is to be Low Pressure Molded, then after the PCB has been manufactured, it will then move on to the next phase which is Low Pressure Molding.
Low Pressure Mold starts out in small pellet form, these pellets are measured out into the correct quantity/weight required and fed into a specialist LPM machine – which also houses the mold template to be filled. The finished PCB is placed into the machine – or a cold-mold set is applied as an initial barrier to any heat from the pressured injection. Then it’s ready for applying the main thermoplastics layer. Once heated to 410F, the Polyamide is then injected – either manually or mechanically using low pressure methods, usually around 50 to 200 PSI.
The flow is maintained and regulated, it will surround components and even begin drying and sealing on contact. The amount injected is measured and directed exactly to fill all the necessary components and leave a finished surface. High-speed advances mean this process typically only takes a few seconds per application, with the completed injection, drying and finishing time extending up to about 1 minute. Resulting in viability for mass production.
Contact us to discuss your requirements of overmolding service. Our experienced sales team can help you identify the options that best suit your needs.
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